Welcome to

                    Advanced Interconnection Technology  

                                   the home of Interconnect Innovation

AIT specialises in the manufacture of interconnection products based on the pattern plating of copper onto ceramic.

 

This combination gives rise to near ideal interconnection properties which include 

    *    High electrical conductivity

    *    Excellent electrical insulation

    *    Exceptional high frequency characteristics

    *    Outstanding thermal management parameters

    *    Good thermal match to silicon and gallium arsenide

    *    Exceptional thermal, chemical and mechanical stability

 

AIT has extended the capabilities of this technology to deliver class leading features which include

    *    Copper thickness up to 300 microns

    *    Feature sizes down to 30 microns

    *    Three dimensional capability

    *    Integrated connection leads

    *    Open or filled vias

 

AIT regularly works with its customers to extend the technology.  In doing so cost effective solutions to demanding requirements are developed and then taken into production.