The circuits are formed as part of a panel of several circuits and the free standing lead is supported until the panel is fractured out.  This gives considerable economy of scale and ease of production.  The picture left shows a typical lead attached to a circuit. 

AIT's processing technology allows a wide range of options to be considered.  Since the leads are formed by photographic imaging, the form of the leads can be optimised for the application.  In particular power leads can be placed on the same substrate as signal leads as shown on the right.

Click on the picture for an enlarged view

Another benefit of this process is that no substrate area is required for attaching a lead frame.  It is therefore possible to place a component very close to the point where the lead leaves the substrate.  This can make a substantial difference in the size of the substrate required.  This process also allows leads to be attached to non rectangular boards.  The image left shows a circular double sided board with plated through holes with integrated radial leads.